SIL·MORE in Taipei, Taiwan in 1996, the beginning of the establishment of the Corporation.
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2018-10-22 20:12 Economic Daily Li Yanqi
In response to the advent of the 5G era, the performance of consumer electronic products continues to increase, and end-users are increasingly demanding transmission speeds. To achieve efficient thermal management and prolonged service life, it is important to dissipate heat on the board, Therefore, in the face of various serious problems of thermal management, Qiao Yue Industrial provides thermal management adhesive application solutions on PCBs according to different process characteristics, to meet the heat-dissipation requirements of future products that are lighter, thinner, smaller and higher.
Compared with traditional thermal conductive materials, Joey's new DOWILTM TC-3015 organic tantalum thermal conductive gel (formerly Dow CorningTM brand) can be cured at room temperature or cured by heat generation on the wafer itself, with good wetting. The low Rc (contact resistance) ensures low heat generation even in the most heat-generating board components such as integrated circuits (ICs) and central processing units (CPUs), enabling efficient heat dissipation of the wafer components. It can be completely stripped and free of residue during heavy work, and can be processed in a variety of ways, which not only simplifies the automated process and does not require too much time, thus replacing the traditional heat sink gasket that affects the design freedom.
In addition, in order to solve the problem that the general-purpose thermal paste is degraded for a long time, the formation of powder after volatilization of the emu oil leads to thermal failure. Qiao Yue provides a single-agent non-ruthenium-based high thermal conductivity adhesive-TCI coating, which has high thermal conductivity and is not easy to be used at high temperatures. It has the advantages of wide flow and wide temperature range and easy forming. It can effectively overcome the shortcomings of traditional thermal conductive resin at high temperature, greatly reduce the viscosity of the resin, improve the settlement of inorganic fillers, and improve the long-term reliability of the interface. It is widely used in the heat dissipation layer coating of electronic components, and then in other applications such as heat dissipation and assembly, especially in the interface application of high power electronic parts products.
Surface protection is also critical from the perspective of PCB fine-line, Dow Chemical's DOWSILTM CC-3122 solvent-free organic germanium coating protection material that provides long-term printed circuit board (PCB) in extreme environmental conditions. Reliability protection. Its low viscosity and low dynamic friction coefficient allow free flow into fine pitches and narrow gaps or spaces on PCBs and components. At the same time, the fast-flowing moisture-curing material supports manual or automatic spraying, which shortens the processing time and does not require oven heating, but gentle heating can greatly speed up the curing. After curing, it has high hardness and low viscosity on the surface, which can protect sensitive components and reduce dust absorption. It has been tested and verified to meet the reliability standards of the automotive industry and contains anti-sulfur corrosion protection. It is suitable for transportation and aviation aerospace. , consumer and industrial applications
Qiao Yue Group will participate in the Taipei Circuit International Exhibition held at the Nangang Exhibition Hall from October 24th to 26th. The exhibition will showcase thermal management and electronic component assembly and application of adhesive materials, with innovative technology and perfect services to help improve product efficiency and stability. Sex. For more information, please go to 011, K District, Nangang Exhibition Hall, or Shangqiao International Website: https://www.silmore.com.tw/.
Source: Economic Daily https://money.udn.com/money/story/5640/3436401