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Epoxy resin SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
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产品描述
Appearance color: black
Viscosity (mPa.s): 3,040
Storage conditions: -20 ° C
Hardness (Shore): 77 (D)
Packing: 30ML
Applications: BGA, CSP flip chip epoxy resin
Curing conditions: 30Mins@80°Cor15Mins@100°Cor10Mins@120°Cor5Mins@150°C
Mixing ratio: single liquid type
Volume resistivity (ohm*cm): 4.5*1015
Density (g/cm3): 1.218
Linear thermal expansion coefficient: 80
Working time (@25°C/HR): 5~7 days
Glass transition temperature (Tg): 30 ° C
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Epoxy resin SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK, 30ML-SYR