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Epoxy resin SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

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0512-57789977

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SIL·MORE in Taipei, Taiwan in 1996, the beginning of the establishment of the Corporation.

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Address:No.90 Tiancheng Road, Kunshan City, Jiangsu Province, China Yushan town north of the city, private development zone

E-Mail :
silmore@silmore.com.cn

TEL:+86-512-5778-9977

FAX:+86-512-5778-9944

 

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Epoxy resin SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

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产品描述

Appearance color: black

Viscosity (mPa.s): 3,040

Storage conditions: -20 ° C

Hardness (Shore): 77 (D)

Packing: 30ML

Applications: BGA, CSP flip chip epoxy resin

Curing conditions: 30Mins@80°Cor15Mins@100°Cor10Mins@120°Cor5Mins@150°C

Mixing ratio: single liquid type

Volume resistivity (ohm*cm): 4.5*1015

Density (g/cm3): 1.218

Linear thermal expansion coefficient: 80

Working time (@25°C/HR): 5~7 days

Glass transition temperature (Tg): 30 ° C

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