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Epoxy resin SIL-MORE EPO-SIL UF 1100 FLIP-CHIP ENCAPSULANT EPOXY BLACK, 30ML-SYR
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产品描述
Appearance color: black liquid
Viscosity (mPa.s): 20,000
Storage conditions: -40oC~-5oC
Hardness (Shore): 90D
Packing: 30ML
Applications: BGA, CSP flip chip epoxy resin
Curing conditions: 30mins@150°Cor10mins@160°C
Mixing ratio: single liquid type
Volume resistivity (ohm*cm): 4.5*1015
Density (g/cm3): 1.57
Linear thermal expansion coefficient: 28
Working time (@25°C/HR): 3 days / Days / 72hrs
Glass transition temperature (Tg): 124 ° C
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