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Epoxy resin SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR

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0512-57789977

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SIL·MORE in Taipei, Taiwan in 1996, the beginning of the establishment of the Corporation.

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Address:No.90 Tiancheng Road, Kunshan City, Jiangsu Province, China Yushan town north of the city, private development zone

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silmore@silmore.com.cn

TEL:+86-512-5778-9977

FAX:+86-512-5778-9944

 

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Epoxy resin SIL-MORE EPO-SIL UF 1378 EPOXY FOR FLIPCHIP ENCAPSULATION BLACK,30ML=45G-SYR

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产品描述

Appearance color: black liquid

Viscosity (mPa.s): 5,200

Storage conditions: -40oC~-5oC

Hardness (Shore): 90D

Packing: 30ML

Applications: BGA, CSP flip chip epoxy resin

Curing conditions: 20Mins@150°C

Mixing ratio: single liquid type

Volume resistivity (ohm*cm): 4.5*1015

Density (g/cm3): 1.6

Linear thermal expansion coefficient: 32

Working time (@25°C/HR): 3-5 days/Days/72~120hrs

Glass transition temperature (Tg): 93 ° C

Corresponding parameter set not found, please add it in property template of background
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暂未实现,敬请期待
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