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Epoxy resin SIL-MORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR

For CSP and BGA wafers, the expansion and contraction stress of the solder ball joint can be buffered, and the shear force transmitted by the reaction force during the drop test can be buffered.

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Epoxy resin


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Product Detail

Appearance color: black

Viscosity (mPa.s): 3,040

Storage conditions: -20 ° C

Hardness (Shore): 77 (D)

Packing: 30ML

Applications: BGA, CSP flip chip epoxy resin

Curing conditions: 30Mins@80°Cor15Mins@100°Cor10Mins@120°Cor5Mins@150°C

Mixing ratio: single liquid type

Volume resistivity (ohm*cm): 4.5*1015

Density (g/cm3): 1.218

Linear thermal expansion coefficient: 80

Working time (@25°C/HR): 5~7 days

Glass transition temperature (Tg): 30 ° C