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Epoxy resin YINCAE SMT 256 / BP256

Tin ball protection material, replacing Under Fill By dipping, screen printing and dispensing applications Improve solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chip and PoP (package-on-package), especially for lead-free applications/replacement underfill materials

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Epoxy resin


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Product Detail

Appearance color: transparent color / black

Viscosity (mPa.s): 5,000~20,000

Storage conditions: -40 ° C @ 6 months

Packing: 10G / SYR, 30G / SYR

Product application: solder joints and solder ball protection materials

Applications: Applications such as BGAFLIPCHIP that require high specification reliability

Mixing ratio: single liquid type

Curing conditions: Reflowprocess (140 ° C ~ 260 ° C)

Certification: RoHS / HF compliant

Date of manufacture / product validity: -40 ° C @ 6 months

Density (g/cm3): 1.05

Working time (@ 25°C/ HR): > 8

Glass transition temperature (Tg) is: 98 ° C

Young's coefficient (@ 25 ° C): 26.3 Gpa