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Non-矽 type thermal conductive adhesive PTTC TCI-B-C260 Non-矽 high thermal conductivity adhesive BLACK, 1KG-CAN

High thermal conductivity / good handling / high temperature crosslinkability / product diversity

Category:

Non-xi type thermal adhesive


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Product Detail

Appearance color: black

Viscosity (mPa.s): 260000 ± 40 %

Temperature range (°C): -40°Cto150°C

Storage conditions: -10 ° C ~ 5 ° C

Hardness (Shore): 99D

Packing: 1Kg/CAN

Specific impedance: >20KV/mm

Product application: TCI (non-矽 type thermal adhesive)

Applications: Thermal materials

Curing conditions: 150 ° C / 60 Mins

Date of manufacture / product validity: 12 months

Insulation strength (KV/mm): >20

Elongation (%): 2.24

Thermal conductivity (Watts/meter°C): 3

Thermal conductivity (W/mK.): 3

Glass transition temperature (Tg): >110

Curing time: 150 ° C / 60 Mins

Thermal resistance (°C, °C/W.) at40Psi: <0.09

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