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Epoxy resin ASKMI R-500B8K3A
The composition does not contain a solvent, and has a low film thickness coating, and the subsequent printing property is stable. After processing, it can be easily peeled off and peeled off without any residue on the surface.
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Epoxy resin
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Product Detail
Appearance color: blue
Viscosity (mPa.s): 350 to 500
Storage conditions: 25 ° C
Packing: 1KG-CAN
Specific impedance: 1011Ω-cm
Product application: peelable glue
Scope of application: Temporary protective material for preventing adhesion of dust and other harmful substances on ITO conductive film during production and processing of touch panel. Mobile tablet flat touch glass OGS process secondary strengthening process, glass CNC cutting, suitable for conductive film and glass
Curing conditions: 130 ° C / 30 Mins, 150 ° C / 30 Mins
Applicable operation mode: easy to peel
Mixing ratio: single liquid type
Date of manufacture / product validity: 3 months
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SIL·MORE in Taipei, Taiwan in 1996, the beginning of the establishment of the Corporation.
Address:No.90 Tiancheng Road, Kunshan City, Jiangsu Province, China Yushan town north of the city, private development zone
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