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Epoxy resin SIL-MORE EPO-SIL 1483 FLIP-CHIP ENCAPSULANT EPOXY RESIN LIGHT YELLOW, 30G-SYR

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Category:

Epoxy resin


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Product Detail

Appearance color: light yellow liquid

Viscosity (mPa.s): 2500~4000

Storage conditions: -40 ° C ~ -5 ° C

Hardness: 80 (D)

Packing: 30ML

Applications: BGA, CSP flip chip epoxy resin

Curing conditions: 30Mins@80°Cor15Mins@100°Cor10Mins@120°Cor5Mins@150°C

Mixing ratio: single liquid type

Volume resistivity (ohm*cm): 4.5*1015

Density (g/cm3): 1.218

Linear thermal expansion coefficient: 80

Working time (@25°C/HR): 2days

Glass transition temperature (Tg): 50 ° C