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Epoxy resin PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR

Low power & conductive silver glue

Category:

Epoxy resin


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Product Detail

Appearance color: silver white

Viscosity (mPa.s): 11,700

Packing: EFD5cc (17.5g/SYR)

Applications: Optocouplers and diodes

Curing conditions: 1Hr@175°C

Mixing ratio: single liquid type

Volume resistivity (ohm*cm): 3.5E-04

Certification: RoHS/HF

Date of manufacture / product validity: -40 ° C @ 12 M

Thermal conductivity (Watts/meter°C): 2.8

Working time (@25°C/HR): 72

Glass transition temperature (Tg): 130

Thixotropic index: 4.94

Modulus coefficient (@25°C/@250°C): 3090MPa, 438MPa