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Epoxy resin PROTAVIC HI-BOND X56-10BFN EC DIE ATTACH ADHESIVE SILVER,5CC=17.5G-SYR
Low power & conductive silver glue
Category：
Epoxy resin
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Product Detail
Appearance color: silver white
Viscosity (mPa.s): 11,700
Packing: EFD5cc (17.5g/SYR)
Applications: Optocouplers and diodes
Curing conditions: 1Hr@175°C
Mixing ratio: single liquid type
Volume resistivity (ohm*cm): 3.5E-04
Certification: RoHS/HF
Date of manufacture / product validity: -40 ° C @ 12 M
Thermal conductivity (Watts/meter°C): 2.8
Working time (@25°C/HR): 72
Glass transition temperature (Tg): 130
Thixotropic index: 4.94
Modulus coefficient (@25°C/@250°C): 3090MPa, 438MPa
CONTACT
SIL·MORE in Taipei, Taiwan in 1996, the beginning of the establishment of the Corporation.
Address:No.90 Tiancheng Road, Kunshan City, Jiangsu Province, China Yushan town north of the city, private development zone
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